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The machine is suitable for chamfering of squared mono- or multi crystalline silicon workpieces in the format of 125 x 125 mm and 156 x 156 mm with two parallel arranged grinding aggregates. Workpiece lengths of 180 up to 500 mm can be processed.
| Advantages |
| 1. Grinding of even (45°) chamfers |
| 2. Equipped with two loading areas for manual and fully automatic loading |
| 3. Pneumatic clamping of workpiece |
| 4. Automatic edge detection and adjustment of grinding tools |
| 5. Automatic wheel correction |
| 6. Detection and evaluation of workpiece specific quality data after grinding |