English
中文 ｜
The machine is suitable for cutting mono crystalline silicon work pieces length is 1200 to 3000 mm. and work piece diameter up to 230 mm, the each brick length is 200 to 1020 mm.
| Advantages |
| 1. Fully automatic load and unload, fixed position, top and tail cutting and analysis wafer cutting. |
| 2. Use the thin film blade and low kerf loss is less than 1.3 mm |
| 3. Longer band saw life time (approx. 12000 to 15000 cuts) |
| 4. Processing of different brick or ingot sizes (125 x 125, 156 x 156, 210 x 210 mm) |
| 5. Lower tool costs |