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This machine is suitable for cutting single crystalline and multi crystalline silicon work pieces up to diameter format of max. 210 x 210 mm with a work piece length between 100 and 500 mm. Minimum segment length is 10 mm.
| Advantages |
| 1. Pneumatic clamping of work piece and segment |
| 2. Equipped for fully automatic or manual loading |
| 3. Low kerf loss: less than 1.3mm |
| 4.Processing of different brick or ingot sizes
(125 x 125, 156 x 156, 210 x 210 mm) |
| 5.Quick set-up time |
| 6. Longer band saw life time ( depend on brick and ingot size 156 x 156 approx. 850 cuts; 125 x 125 approx. 1300 cuts) |
| 7. low tool costs |
| Technical data |
| 1. Workpiece length: 100 - 500 mm |
| 2. Machine: 2500 x 2600 x 200 mm (LxWxH) |
| 3. Machine weight: 6000 kg |
| 4. Coolant grease: water |
| 5. Length sawing band: 5500 mm x 0.75mm x 50mm (LxWxH) |
| 6. Cycle time: ≤ 10 min |